Substrate Materials

Material

Typical thickness (mm)

Typical dimension

Thermal conductivity

Al2O3 Wafer

0.38/ 0.5 /0.635/0.8/1mm

 4.5" /5”

20~27 W/mK

Al2O3 Chip

0.38/ 0.5 /0.635/0.8/1mm

Customized

AlN Wafer

0.38/ 0.5 /0.635

 4.5“/5”

170~200 W/mK

ALN Chip

0.38/ 0.5 /0.635

Customized

Wafer Drawing

Material

Pattern construction

Laser drill for via-holes

Laser scribing

Line width for dicing saw

Clearance distance from edge to metalized pattern

Al2O3 Wafer

Single Face          Double face          With Via-holes                  Customized

80~200 um,    150 um typically

1/4~1/2  substrate thickness , 1/3  substrate thickness typically

150~300 um,          200 um typically

6mm (as the thickness of the metalized layer less than 30 um)       8 mm (as the thickness of the metalized layer higher than 30 um)

AlN Wafer

Al2O3 Chip

ALN Chip