• 產品規格:R200/R50/R220
  • 產品尺寸:
  • 產品簡介:陶瓷微電阻應用於◆ Switching Power Supply◆ Voltage Regulati
  • 產品說明:

            This specification applies of high power chip current sensing resistor rectangular type.

     

     

    Features                                            Application

    Chip size from 0402 to 2512                                        Switching Power Supply

    Resistance value from 0.05W to 1W                            Voltage Regulation Module

    Lead free, RoHs compliant for global applications          DC-DC Converter, Adaptor, Battery Pack, Charger

    and halogen free                                                      PDA & Cell Phone

                                                                                        Power management Applications



    Dimensions

              陶瓷微電阻





     

    Chip Size

    (inch)

    Dimensions  (Unitmm)

    L

    W

    t

    A

    B

    0603

    1.55±0.10

    0.80±0.10

    0.45±0.10

    0.30±0.20

    0.35±0.20

    0805

    2.10±0.15

    1.30±0.15

    0.65±0.15

    0.40±0.20

    0.35±0.20

    1206 S-type

    R>100mΩ

    3.10±0.20

    1.65±0.10

    0.65±0.15

    0.50±0.30

    0.40±0.20

    1206 L-type

    R<100mΩ

    0.80±0.30













    Part Numbers

     

    CCSH

    12

    T

    F

    R050

    (1)

    (2)

    (3)

    (4)

    (5)

    (1) Series name: CCSH= High Power Chip Current Sensing Resistor

    (2) Chip Size: 04=0402, 06=0603, 08=0805, 12=1206, 20=2010, 25=2512

    (3) Packaging Type: T=Paper Tape, E=Embossed Tape

    (4) Tolerance: F=±1%, G=±2%, J=±5%

    (5) Resistance: R050=50mW

     

    Derating Curve

    Derating Curve

     

    Electrical Specification

     

    Type

    Power Rating

    Operation Temp. Range

    Resistance Range(mΩ)

    TCR (PPM/)

    1%

    2%

    5%

    0603

    1/8W

    -55~+155

    50-99

    100-499

    500-976

    ±800

    ±500

    ±200

    0805

    1/4W

    1206

    1/2W








     

    Performances

     

    Environmental Performance

    No.

    Item

    Test Condition

    Specification

    1%, 2%

    5%

    1

    Short Time Overload

    5X rated power for 5 sec.  (JIS-C5202-5.5)

    ±(1%+0.05W)

    ±(2%+0.05W)

    2

    Temperature Coefficient of Resistance (T.C.R.)

    +25°C/+125°C. (JIS-C5202-5.2)

    Refer to Electrical Specification

    3

    Damp Heat with Load

    The specimens shall be placed in a chamber and subjected to a relative humidity of 90~95% percent and a temperature of 40° ±2°Cfor the period of 1000 hrs. (MIL-STD-202, Method 103)

    ±(2%+0.05W)

    ±(3%+0.05W)

    4

    High Temperature Exposure

    The ship (mounted on board) is exposed in the heat chamber 125±3℃for 1000 hrs. (JIS-C5202-7.2)

    ±(1%+0.05W)

    ±(1.5%+0.05W)

    5

    Load Life

    Apply rated power at 70±2°Cfor 1000 hours with 1.5 hours ON and 0.5 hour OFF. (JIS-C5202-7.10)

    ±(2%+0.05W)

    ±(3%+0.05W)

    6

    Rapid change of temperature

    The chip (mounted on board) is exposed, -55±3°C(30min.)/+125±2°C(30min.) for 5 cycles.

    The following conditions as the following figure.

    (JIS-C5202-7.4)

    ±(0.5%+0.05W)

    ±(1%+0.05W)

     

    Function Performance

    No.

    Item

    Test Condition

    Specification

    1%, 2%

    5%

    1

    Bending Strength

    Mount the chip to test substrate. Apply pressure in direction of arrow unit band width reaches3mm(+0.2/-0mm) illustrated in the figure below and hold for 10±1 sec. (JIS-C5202-6.1)

    ±(1%+0.05W)

     

    5

    Solvent Resistance

    The chip is completed immersion of the specimens in the isopropyl alcohol for 3 *+5, -0) min.,

    25°C ±5°C. (MIL-STD-202, Method 215)

    Verify marking permanency. (Nor required for laser etched parts or parts with no marking)

     

    6

    Resistance to solder Heat

    The specimen chip shall be immersed into the flux specified in the solder bath 260±5°Cfor 10±1 sec.

     (MIL-STD-202, Method 210)

    ±(0.5%+0.05W)

    ±(1%+0.05W)

     

    7

    Solderability

    The specimen chip shall be immersed into the flux specified in the solder bath 235±5°Cfor 2±0.5 sec. It shall be immersed to a point10mmfrom its root. (Sn96.5/Ag3.0/Cu0.5) (JIS-C5 202-6.11)

    Solder shall be covered 95% or more of the electrode area.

     

     


    Tape Packaging Specifications

     

    Paper Tape Specifications      

     

                                                                                                                                                       Unitmm

    Type

    Carrier Dimensions

    A

    B

    E

    F

    W

    P0

    P1

    P2

    D0

    T

    0603

    1.1±0.1

    1.9±0.1

    1.75±0.1

    3.5±0.05

    8.0±0.2

    4.0±0.1

    4.0±0.1

    2.0±0.05

    1.55±0.05

    0.64±0.1

    0805

    1.6±0.1

    2.4±0.1

    1.75±0.1

    3.5±0.05

    8.0±0.2

    4.0±0.1

    4.0±0.1

    2.0±0.05

    1.55±0.05

    0.97±0.1

    1206

    2.0±0.1

    3.6±0.1

    1.75±0.1

    3.5±0.05

    8.0±0.2

    4.0±0.1

    4.0±0.1

    2.0±0.05

    1.55±0.05

    0.97±0.1

     

     

           Packaging

     

    Size EIA (EIAJ)

    0402

    0603/0805/1206

    2010/2512

    Standard Packing Quantity (pcs /reel)

    10,000

    5,000

    4,000

     

     

     

           Storage Conditions

     Temperature5~35, Humidity40~75%

     

     

    Recommended Pad Layout

     

    Type

    Pad Layout Dimension (mm)

    a

    b

    c

    0603

    0.90

    0.70

    1.00

    0805

    1.20

    1.20

    1.40

    1206

    2.20

    1.30

    1.80

                                                   Unitmm


    Soldering Recommendations

    Peak reflow temperatures and durations

       - IR Reflow Peak =260max for 10 sec

       - Wave Solder =260max for 10 sec

    Compatible with lead and lead-free solder reflow processes

    Recommended IR Reflow Profile

     

    ECN

     Engineering Change NoticeThe customer will be informed with ECN if there is significant modification on the

     characteristics and materials described in Approval Sheet.

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